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BGA,
uBGA, CSP, oddform, 0402, 0201, 01005 Assembly,Contract
Electronic Manufacturing Services,SMT, automatic insertion,
hand assembly & high level ssembly,Rapid new product
introduction assembly,IPC/BSI certified RoHS compliant
soldering processes.
Advanced Manufacturing Services
Technologies and Capabilities Include:
# 0402 and 0201 package types
# Chip Scale Package (CSP)
# BGA and uBGA double-sided/mirrored BGA assembly
# COB and MCM
# Direct and multiple chip attach
# High pin count press fit
# Gold and aluminum wedge-bonding
# Wire-bonding
# Flex Circuits
# Wave solder
# Selective soldering
# Aqueous cleaning
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QFN and BGA board Assembly |
0201,0402 package PCB Assembly |
Immersion Gold PCB 0201 |
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Immersion Gold PCB, BGA/0201 |
Immersion silver PCB,BGA/0402 |
Laser stencil(use for BGA and
0201,0402) |
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Normal stencil(use for 0805,1206
package)
This Photo is From Microscope, 100x |
QFN&QFP 0201,0402 board |
QFN&QFP 0201,0402 board |
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QFN&QFP 0201,0402 board |
Thru hole wave soldering |
Thru hole wave soldering |
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SMT Assembly |
QFN&QFP 0201,0402 board |
SMT Assembly |
Our
advantage: Sr. Engineer will go through the whole
process: Design - component procure - PCB Fabrication
- Assembly, we can make High Quality Data work,
High Quality component,High Quality PCB, High Quality
Assembly, and with these effort will come out High
grade and reliable product.
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