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Printed circuit board
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Part of a 1983 Sinclair ZX Spectrum computer board; a populated
PCB, showing the conductive traces, vias (the through-hole paths
to the other surface), and some mounted electrical components
PCB Layout ProgramA printed circuit board, or PCB, is used to
mechanically support and electrically connect electronic components
using conductive pathways, or traces, etched from copper sheets
laminated onto a non-conductive substrate. Alternative names
are printed wiring board (PWB),and etched wiring board. A PCB
populated with electronic components is a printed circuit assembly
(PCA), also known as a printed circuit board assembly (PCBA).
PCBs are rugged, inexpensive, and can be highly reliable.
They require much more layout effort and higher initial cost
than either wire-wrapped or point-to-point constructed circuits,
but are much cheaper and faster for high-volume production.
Much of the electronics industry's PCB design, assembly, and
quality control needs are set by standards that are published
by the IPC organization.photomask is usually prepared with
a photoplotter from data produced by a technician using CAM,
or computer-aided manufacturing software. Laser-printed transparencies
are typically employed for phototools; however, direct laser
imaging techniques are being employed to replace phototools
for high-resolution requirements.
PCB milling uses a two or three-axis mechanical milling system
to mill away the copper foil from the substrate. A PCB milling
machine (referred to as a 'PCB Prototyper') operates in a
similar way to a plotter, receiving commands from the host
software that control the position of the milling head in
the x, y, and (if relevant) z axis. Data to drive the Prototyper
is extracted from files generated in PCB design software and
stored in HPGL or Gerber file format.
"Additive" processes also exist. The most common
is the "semi-additive" process. In this version,
the unpatterned board has a thin layer of copper already on
it. A reverse mask is then applied. (Unlike a subtractive
process mask, this mask exposes those parts of the substrate
that will eventually become the traces.) Additional copper
is then plated onto the board in the unmasked areas; copper
may be plated to any desired weight. Tin-lead or other surface
platings are then applied. The mask is stripped away and a
brief etching step removes the now-exposed original copper
laminate from the board, isolating the individual traces.
The additive process is commonly used for multi-layer boards
as it facilitates the plating-through of the holes (to produce
conductive vias) in the circuit board.
[edit] Lamination
Some PCBs have trace layers inside the PCB and are called
multi-layer PCBs. These are formed by bonding together separately
etched thin boards.
[edit] Drilling
Holes, or vias, through a PCB are typically drilled with tiny
drill bits made of solid tungsten carbide. The drilling is
performed by automated drilling machines with placement controlled
by a drill tape or drill file. These computer-generated files
are also called numerically controlled drill (NCD) files or
"Excellon files". The drill file describes the location
and size of each drilled hole.
When very small vias are required, drilling with mechanical
bits is costly because of high rates of wear and breakage.
In this case, the vias may be evaporated by lasers. Laser-drilled
vias typically have an inferior surface finish inside the
hole. These holes are called micro vias.
It is also possible with controlled-depth drilling, laser
drilling, or by pre-drilling the individual sheets of the
PCB before lamination, to produce holes that connect only
some of the copper layers, rather than passing through the
entire board. These holes are called blind vias when they
connect an internal copper layer to an outer layer, or buried
vias when they connect two or more internal copper layers
and no outer layers.
The walls of the holes, for boards with 2 or more layers,
are plated with copper to form plated-through holes that electrically
connect the conducting layers of the PCB. For multilayer boards,
those with 4 layers or more, drilling typically produces a
smear comprised of the bonding agent in the laminate system.
Before the holes can be plated through, this smear must be
removed by a chemical de-smear process, or by plasma-etch.
[edit] Exposed conductor plating and coating
The places to which components will be mounted are typically
plated, because bare copper oxidizes quickly, and therefore
is not readily solderable. Traditionally, any exposed copper
was plated with solder by hot air solder levelling (HASL).
This solder was a tin-lead alloy, however new solder compounds
are now used to achieve compliance with the RoHS directive
in the EU, which restricts the use of lead. Other platings
used are OSP (organic surface protectant), immersion silver
(IAg), immersion tin, electroless nickel with immersion gold
coating (ENIG), and direct gold. Edge connectors, placed along
one edge of some boards, are often gold plated.
Electrochemical migration (ECM) is the growth of conductive
metal filaments on or in a printed circuit board (PCB) under
the influence of a DC voltage bias.[1][2]
[edit] Solder resist
Areas that should not be soldered to may be covered with a
polymer solder resist (solder mask) coating. The solder resist
prevents solder from bridging between conductors and thereby
creating short circuits. Solder resist also provides some
protection from the environment.
[edit] Printed circuit assembly
After the printed circuit board (PCB) is completed, electronic
components must be attached to form a functional printed circuit
assembly[3][4], or PCA (sometimes called a "printed circuit
board assembly" PCBA). In through-hole construction,
component leads are inserted in holes. In surface-mount construction,
the components are placed on pads or lands on the outer surfaces
of the PCB. In both kinds of construction, component leads
are electrically and mechanically fixed to the board with
a molten metal solder.
There are a variety of soldering techniques used to attach
components to a PCB. High volume production is usually done
with machine placement and bulk wave soldering or reflow ovens,
but skilled technicians are able to solder very tiny parts
(for instance 0201 packages which are 0.02" by 0.01")
by hand under a microscope, using tweezers and a fine tip
soldering iron for small volume prototypes. Some parts are
impossible to solder by hand, such as ball grid array (BGA)
packages.
Often, through-hole and surface-mount construction must be
combined in a single PCA because some required components
are available only in surface-mount packages, while others
are available only in through-hole packages. Another reason
to use both methods is that through-hole mounting can provide
needed strength for components likely to endure physical stress,
while components that are expected to go untouched will take
up less space using surface-mount techniques.
After the board has been populated it may be tested in a
variety of ways:
While the power is off, visual inspection, automated optical
inspection. JEDEC guidelines for PCB component placement,
soldering, and inspection are commonly used to maintain quality
control in this stage of PCB manufacturing.
While the power is off, analog signature analysis, power-off
testing.
While the power is on, in-circuit test, where physical measurements
(i.e. voltage, frequency) can be done.
While the power is on, functional test, just checking if the
PCB does what it had been designed for.
To facilitate these tests, PCBs may be designed with extra
pads to make temporary connections. Sometimes these pads must
be isolated with resistors. The in-circuit test may also exercise
boundary scan test features of some components. In-circuit
test systems may also be used to program nonvolatile memory
components on the board.
In boundary scan testing, test circuits integrated into various
ICs on the board form temporary connections between the PCB
traces to test that the ICs are mounted correctly. Boundary
scan testing requires that all the ICs to be tested use a
standard test configuration procedure, the most common one
being the Joint Test Action Group (JTAG) standard.
When boards fail the test, technicians may desolder and replace
failed components (professional term: rework).
[edit] Protection and packaging
PCBs intended for extreme environments often have a conformal
coat, which is applied by dipping or spraying after the components
have been soldered. The coat prevents corrosion and leakage
currents or shorting due to Electronic Structural Components,
Metalworking and Fabrication Services, Engineering Design
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^ Ayob M. and Kendall G. (2005) A Triple Objective Function
with a Chebychev Dynamic Pick-and-place Point Specification
Approach to Optimise the Surface
[edit] External links
Wikibooks Practical Electronics has a page on the topic of
PCB LayoutWikimedia Commons has media related to:
Printed Circuit Board
[edit] Design guidelines
PWB/PCB Design – Analog, RF & EMC Considerations in Printed
Wiring Board Design
High Frequency Laminate Information by Chet Guiles
EMC Design Guideline Collection on the Clemson Vehicular Electronics
Laboratory web site
SN100CL Minimum Thickness Guidelines on Saturn Electronics
website.
[edit] Standards and specifications
Association Connecting Electronics Industries (IPC)
MIL-PRF-31032, Performance Specification Printed Circuit Board/Printed
Wiring Board
MIL-PRF-55110, Performance Specification for Rigid Printed
Circuit Board/Printed Wiring Board
MIL-PRF-50884, Performance Specification for Flexible and
Rigid-Flexible Printed Circuit Board/Printed Wiring Board
[edit] Do-it-yourself (DIY) guides
Making PCBs using DIY cnc hardware
Making PCBs with a laser printer and photo paper, no UV machine
needed anymore.
More detailed PCB DIY making with laser printer
Making PCBs by hand using an etch-resist pen (no printer or
special paper needed)
Open Source Hardware Initiative (open hardware).
[edit] Others
First PCB Patent - Patent No 2,756,485 - Process of Assembling
Electrical Circuits (pdf)
List of PCB trade shows
General Information on Printed Board Programs
PCB Trace Impedance Calculator
Retrieved from "http://en.wikipedia.org/wiki/Printed_circuit_board"
Categories: Electrical engineering | Electronics manufacturing
| Electronic engineering | Electricity distribution
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Printed Circuit Board (PCB) Design
Printed Circuit Board (PCB) Development
Printed Circuit Board (PCB) Wiring
Printed Circuit Board (PCB) Procurement
Printed Circuit Board (PCB) Testing
Printed Circuit Board (PCB) Engraving
Printed Circuit Board (PCB) Soldering
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