Material: FR4 Layer Coverage: 12Layers Thickness: 3.2mm Surface Technique: Immersion Gold Line Width/Space: 12mil/12mil Solder Mask Color: Green

Company: Zhejiang Zapon Electronic Technology Co., Ltd. [Province:Zhejiang, China]
82. PCB 002 [20080815]

PCB002 Material: FR4 TG170 Size: 160mm x 120mm /2 Layer Coverage: 6 Layers Thickness: 1.0mm Surface Technique: Immersion gold Line Width/Space: ...

Company: Glovics Technology (HK) Co., Ltd. [Province:Guangdong, China]
83. PCB12 (ABP009) [20080816]

PCB specification: Material: FR4 Layer: 4Layer boards Copper clad thickness: 1/1 1/1oz Etest: Fixture test Surface finish: Immersion Gold

Company: ABP Electronics Limited [Province:Guangdong, China]
84. 4 Layer PCB (CKT4) [20080816]

4layer gold plating PCB Layer Number: 4 Materials: FR4 Board thickness: 1.6mm Finishing: Plating gold + white legend Minimum hole size: 0.20mm ...

Company: Cirket Electronics Company [Province:Guangdong, China]
85. OSP PCB [20080816]

Material: FR4 Layer Coverage: 4L Thickness: 1.6 MM Surface Technique: OSP Line Width/Space: 4mil/4mil Solder Mask Color: Green

Company: Zhejiang Zapon Electronic Technology Co., Ltd. [Province:Zhejiang, China]
86. Membrane Keypad [20080813]

Overlay Materials: The most commonly used base materials are polyester and polycarbonate. Rear Adhesive: 3M 467MP, 3M 468MP, etc. Standard ...

Company: Cixi Membrane Switch Factory [Province:Zhejiang, China]
87. PCB [20080623]

Single Side FPC Material: Polyimide, Copper; Copper: 1.0 oz, ED; Coverlayer: Polyimide, 1 mil; Thickness: 0.1381 mm; Line Width/Space: ...

Company: Shenzhen Jingbang Technology Co., Ltd. [Province:Guangdong, China]
91. PCB(LKPCB02) [20080814]

1 Number of Layer: 2 to 20 layers. 2 Base Material: FR4, CEM3, Teflon, Aluminum Substrate, Rogers, Halogen Free, High Tg. 3 The color of ...

Company: Shenzhen Longkun Technology Co., Ltd. [Province:Guangdong, China]
92. 12 Layer PCB Products [20080816]

Layer: 12 Material: FR4 Thickness: 1.6mm ROHS&UL standard Min line width: 0.12mm Min line space: 0.12mm The smallest hole: 0.2mm Buried and blind via ...

Company: Shenzhen Jingbang Technology Co., Ltd. [Province:Guangdong, China]
93. PCB Assembly (ROHS PCBA for LED PCB) [20080816]

Doublesided pcb(DSB) Basematerial: FR4 Board thickness: 1.6MM Solder mask Color: Green Liquid Photo Imageable Soldermask(LPI) Silkscreen: ...

Company: Hongkong Wah Shun Electronic Technology Limited [Province:Guangdong, China]

[ PCBA Related Products ]
94. PCBA (ROHS) [20080816]

Minimum space size: 0.5mm ROHS & UL standard NO. Of IC: 20PCS Soldering compoent: 1578 pcs Minum compoent size: 0603

Company: Shenzhen Jingbang Technology Co., Ltd. [Province:Guangdong, China]
95. PCBA 2 [20080816]

PCB Assembly 9 SMT lines and 2 DIP lines Min. Chip size: 0201 BGA and Bonding are available ROHS compliance Employee No.: More than 200 Test ...

Company: Cirket Electronics Company [Province:Guangdong, China]

[ PCBA Related Products ]
96. Double Sided PCB (003) [20080815]

PCB003 Layers: Doublesided PCB Thickness: 1.6mm FR4 material Solder mask: Red Component mark: White P

Company: Glovics Technology (HK) Co., Ltd. [Province:Guangdong, China]
97. Computer Board [20080816]

Our main products include: Computer network adapter, mouse board, U disc and keyboard, etc.; Audio/video products, such as CD plate, DVD decode plate ...

Company: Tecoo Electronics Co., Ltd. [Province:Zhejiang, China]

For the last 20 years, we use "Specialized Technology, First Class Quality, Well Service, Client is God" as our work principle, produce different kind and different application's product for our customer.

We had produced, processed much PCB for many different kind of products, including keyboard, mouse, printer, LCD display, DVD player, MP3, wireless phone, PDA, calculator, digital camera, toys, remote control, etc.

Clients come from Europe, USA, Japan, Taiwan, Hong Kong, etc.

　
Wire Bonding
Nowadays, electronic products are getting smaller and smaller. Engineer need to design small chips and the circuit on a printed circuit board (PCB) which will use in their product.

How do these chips connect to the PCB?

Wire Bonding, we use wire connect from the I/O on the chip to the PCB.

Since the wire used is so thin that is very easy to break or bend, epoxy resin is used to encapsulate the chip. Then put the PCB into the oven for some times, the epoxy resin will get hard and protect the chip and wire. This process is called molding.

This technology is called Chip on Board (COB). COB Technology has become a very important production technology now.

Our COB Department has more than 20 years experience on COB technology and the production work flow.

　
Printed Circuit Board Assembly (PCBA)
The process of putting any electronics component onto a PCB is called PCBA.

Component Insertion
For different reason, some electronics products need to put electronics component on the PCB by hand. Then solder the joint by hand soldering or by wave soldering.

Our PCBA Department has many years experience on hand soldering and wave soldering.

Surface Mount Technology (SMT)
As stated above, electronics product are getting smaller and smaller. Many new materials had been found and used in produce small electronics component. These component are hardly put on the PCB by hand. This required high accuracy and high stability. SMT is arise to fulfill this need.

SMT need to print solder paste on the component position on the PCB first. Then use surface mount machine to mount electronics components on the PCB. At last put the PCB into the reflow oven. Solder paste will get melt because of heat and then cool down inside the reflow oven. Soldering finished.

Our SMT Department has many years experience on SMT Technology and the automated production work flow.Putting XRays to the Test:
Inspecting for SolderJoint Failure
By Ron Iscoff, Editor When a German physicist, Wilhelm Conrad Roentgen, accidentally discovered a form of radiation in 1895, he named it "xray" because of its unknown nature.1

While xrays (electromagnetic radiation operating in wavelengths from 100 ?0.01 ? have become most familiar as tools for diagnosing human ailments, they are also finding increasing use in the electronics industry, mainly for the detection of anomalies on PC board assemblies (PCBA). The vast majority of PCBA defects are solderjoint related, according to most experts.

Solder Bond

Figure 1. The HP 5DX Series II integrates a timelapse, rotated image of the PC board from an electronically steerable xray source.
One area of ongoing concern in chipscale packaging, which strongly and directly addresses the bottom line, is the quality of the solder bond between the mounted CSP and the PC board. Xray inspection equipment, when integrated into the PCBA manufacturing flow, can reveal many solderjoint anomalies, including excess or insufficient solder, bridging, no reflow, voids, missing balls, and skewed placement.2 Available systems may cost anywhere from $50,000 to $500,000 depending on the level of automation, handling options and computing power. Manual systems require the operator to load and unload the samples to be inspected. They also require the operator to employ a degree of skill in reading the sample's xray "signature" from the video monitor and deciding whether a sample has failed.

1.0 INTRODUCTION:
Until the introduction of bottomside preheating stations, two of the most critical processes which are instrumental to successful SMT & BGA tasks at the benchtop are unfortunately, the two most commonly neglected: 1) Properly preheating the printed circuit substrate before attempting reflow, and 2) Initiating a quick "cool down" of the solder joints after reflow. This applies to all benchtop work from design & prototyping and low volume production to rework and repair of the PCB assembly (PCBA).

Because the two fundamental processes of preheating and postcooling are often ignored by benchtop technicians, many problems arise. And worse, with rework tasks, costly PCB's which are sometimes considered "repaired" are, in fact, worse off after the rework than they were before it began. While some "rework" damage can sometimes be detected by a qualified, postoperation inspector, in many cases the damage is not always visible or even immediately manifested in a circuit test.

While I will address the discipline of rework and repair in this paper, please keep in mind that everything applies just the same with prototype and design tasks and to the low volume production runs of PCB assemblies.

1.1 PREHEATING THE PREREQUISITE FOR ALL SUCCESSFUL PCB PROCESSING:
Certainly, the application of elevated thermal ranges (600° 800°F or 315°C 425°C) to the PCB for extended periods of time can present the potential for many problems. Thermal damage such as lifted pads and traces, substrate delamination, measling or bubbling, discoloration, board warping and burning is usually noticeable to a trained inspector. However, just because one hasn't "burned the board," doesn't mean that it is not damaged.

Typically, the "unseen" harm done to PCB's by high temperatures can be even worse than the many problems listed above. Decades of countless testing has repeatedly shown that PCB's and their components can "pass" postrework inspection and testing only to later fail at a higher than normal rate due to the degradation of the circuit and components experienced during high temperature "rework."

Such "invisible" problems as the internal fracture of the substrate and/or the degradation of its electronic components result from the rapid and unequal expansion of dissimilar materials. Ominously, these problems may not reveal themselves visually or even be detectable in an initial circuit test, yet still latently lurk within the PCB assembly. Although the "rework" looked good, it's sort of like the old saying, "the operation was a success, but unfortunately, the patient died."

Imagine the tremendous thermal stress which occurs when a PCB, which has been stable at an ambient or room temperature of 70°F (21°C), is suddenly subjected to a localized application of 700°F (371°C) of heat from either a soldering iron, desoldering tool, or a hot air jet. There is an immediate delta temperature change of 630°F (332°C) to the board and its components. No wonder the term "popcorning" has recently entered our vocabulary. Popcorning refers to the actual degradation to an IC or SMD when moisture within the device is rapidly heated during rework processes and a miniexplosion or rupture occurs.Hot Searches: ceramic, handbags, TV, boots, HID, Amplifier, fittings, cement, tractor, wireless
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Metallized Polypropylene Film Capacitor CBB62
Operating temperature range: Max. operating temperature Top, max 100
Centigrade Upper category temperature Tmax 100 Centigrade Lower
category temperature Tmin 55 Centigrade Rated capacitance CR: 0...




from Ningbo Topo Electronic Co., Ltd. [China] TrustPoints: 200
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PCBA Printed Circuit Board
PCBA: printed circuit board with assembly a)Being a PCB producer, we
always have a very close relationship with the design b)As a result, we
are in a very good position in supplying not just PCB , b...




from Shenzhen K-better Electrical Co., Ltd [China] TrustPoints: 10

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Rigid-Flex Printed Circuit Board
PCB Rigid-flex circuit board *Min. line width: 0.10mm *Min.hole
diameter: ?|0.25mm *Material: a) polyamide flexibleness
Futon ban b)FR-4 ethylene board *thickness: a) polyam...




from Shenzhen K-better Electrical Co., Ltd [China] TrustPoints: 10

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PCB multilayer circuit boards *Layers:4-12 *Base material: FR-4
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from Shenzhen K-better Electrical Co., Ltd [China] TrustPoints: 10

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Single Sided Printed Circuit Board
PCB single-sided printed circuit board *Base material: FR-4
CEM-1 *Copper thickness: 0.5-2.0 oz *Thickness: 0.2-3.0mm *Solder
mask: green, black, red, yellow, white *Min. line width: 0.3mm *M...




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PCBA printed circuit board assembled *Layers:4-12 *Base material: FR-4
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from Shenzhen K-better Electrical Co., Ltd [China] TrustPoints: 10

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multilayer circuit board
（ multilayer PCB ?Layers:4-12 ?Base material: FR-4
?Thickness: 0.5-3.0mm ?Solder mask: green, black , red , yellow ,
white ?Min. line width: 0.075mm ?Min. line space: 0.075mm ... SMT Feeders

SMT Feeders: FUJI, YAMAHA, SONY, PANASONIC
| Yamaha Feeders & Philips Feeders | Philips/Assembleon Feeders | JUKI Feeder | Fuji Feeders | Feeder parts - tape guide | Panasert Feeder parts | SONY FEEDERS | Stick feeder | Feeder parts - Cover | Feeder parts - Pin and Spring | Feeder parts - Link set |



SMT Nozzles

Nozzles: Siemens, Universal, Samsung, Juki, Fuji, Yamaha, Panasonic, KME, Sony, Sanyo
| FUJI Nozzle | CASIO Nozzle | SANYO (Universal HSP) NOZZLE | Yamaha (Philips) Nozzle | JUKI Nozzle | Panasonic Nozzles | KME Nozzle | SAMSUNG NOZZLE | SONY NOZZLE | TENRYU NOZZLE | Siemens Nozzles | Universal GSM nozzle | Mirae nozzle | Nozzle Fitlers |



SMT Spare Parts

Spare parts for SMT printer, dispenser, pick and place machine, reflow soldering oven, AOI, conveyor, etc.
| PRINTER PARTS | SMT Cutters |



Pick&Place Machine

Pick & Place Machine: surface mounter, collect and place, chip shooter,
| Panasonic Pick&Place | Assembleon Pick&Place | JUKI Pick&Place | Siemens Pick&Place | Used Equipment |



Speedline Products

Speedline technologies, Semiconductor manufacturing, ACCEL, CAMALOT, MPM, ELECTROVERT, Dispensing systems, Stencil printers, Reflow oven, MEMS manufacturing, Wafer bumping, Underfill, Dispensing systems, Lead free wave solder
Provide new machines and spare parts through preferential distributor
| ACCEL Cleaner | CAMALOT Dispenser | MPM Stencil Printer | ELECTROVERT Soldering Systems |



EKRA Screen and Stencil Printer

EKRA Screen and Stencil Printer

Provide spare parts through preferential distributor
| Spare Parts for EKRA Printer |



Spare Parts for A/I

Auto-Insertion Machine for electronics component assembly on PCB.
1) Panasert AI machine
2) Universal AI machine
3) TDK AI machines

| Universal AI parts | TDK AI parts | Dynapert A.I. Spareparts | Panasert AI parts | Panasert AI parts - JV | Panasert AI parts - RH | Panasert AI parts - AV |



SMT Peripherals

SMT peripherals / accessories
| Feeder Calibration | SMD chip couter | Dispensing controller | Reflow checker | High speed cream solder mixer | High speed centrifuge machine | SMD Taping machine | Pneumatic stencil screens PCB clean machine | PCB separator |

Brand Name: Avcom SMT, Inc

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AVCOM SMT INC [US]

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Features Specifications: Pcba, Smt, And Rework
SimpleLan R1.4: 1548957

Avcom has the capability to assemble through-hole, surface mount and mixed technology boards (including bgas) and specialize in quick turn and prototype jobs. For large volume jobs avcom's fuji line makes it possible to run 14,000+ components per hour and the amistar 6448 axial machine allows up to 5,000 axial leaded component insertions per hour. Also, avcom utilizes panasonic softbeam and robotic soldering machines to automate hand-soldering tasks when assemblies do not fit the wave solder or oven soldering process.

Standard assembly is to IPC a-610 rev c class II standards, and complies with class iii requirements when requested. Avcom's experienced inspectors use a variety of microscopic inspection equipment to back our thorough process control and job documentation practices.

Avcom employs smt tools bga-100 optical inspection system for bga components and can rework and repair standard surface mount components, as well as, bga components with a pace tf-700 programmable, hot-air rework system.
Two fuji cp-iv hi-speed placement machines
Fuji ip-ii hi-speed placement machine
Fuji gsp iii screen printer
Phillips csm smd placement machine
Aps manual screen printer
Asymtek automove 403 glue dot machine
Research INC. Xg10 reflow oven
Three panasonic softbeam solder robots
Panasonic robotic solder system
Amistar 6448,122 station axial lead inserter
Electrovert ultrapak 600c wave solder
Trieber aqueous wash system
Custom tooling machine shop
Conformal coating booth
Nordson select coat UV coating machine
Pace tf700 rework station-bga placement/repair
Mantis, baush & lomb, dyanscope stereo scopes
Smt tools INC. Bga optical inspection scope
Novastar lead - free wave solder
Microchip promate II programmer
Sp-680 universal programmer K-better electronic circuit board factory in Shenzhen was established in 1996,which is engaged in printing circuit board production.

The top-grade talented person, the top-grade equipments produces a top-grade product.K-better electronic circuit board factory is especially existing 165 employees, the factory premises area is 2500 square meters.It own the advanced circuit board production line, the existing digital control drilling machine, optical painting equipment to expose only machine, develop machine, spray tin machine, eclipse to engrave machine, test machine, 60 tons blunt press machine, whole electroplate production line and self-provided environment a processing engineering etc.

Warm welcome you desire or enquiries negotiations. Nasty you it nasty, contribute efforts to you with all sincerity is our commitment.We are in hopes of your cooperation!

Our advantage: best products, high speed, reasonable price, best service.
Please contact at candypcb(at)gmail(dot)com.

Featured Products >> More
PCBA PCB Assembly Flexible PCB MultiLayer PCB Double-sided PCB Other Information
Business Type: Manufacture
Industry: Electronic Components & Supplies
Main Products: PCB , PCBA , FPC , Flexible , component , circuit board , SMT , solder mask
Main Markets: Americas
Africa
Asia
Europe
Middle East
Worldwide CAPP for Electronics Manufacturing Case Study: Fine Pitch SMT Laser Soldering
Journal of Electronic Packaging -- March 2004 -- Volume 126, Issue 1, pp. 173-176

Ismail Fidan

Department of Manufacturing & Industrial Technology, College of Engineering, Tennessee Tech University, Cookeville, TN 38505-5003
(Received March 2003)

The trend to high-density packaging in surface mount assembly has highlighted inherent difficulties in the assembly line of these very fine pitch devices. A variety of defects is still common in printed circuit board assembly (PCBA) technology despite all the improvements made, and rework of PCBA is inevitable and performed manually in PCBA manufacturing floors since the cost of each component and PCB itself may be hundreds of dollars. In the last few years, the number of rework stations available on the market has grown considerably including the automated ones, but there has still been no significant reduction in the number of the defects. In electronics manufacturing, rework is defined as the activity that replaces defective components with those that are acceptable such that the populated board performs to the specifications. Increasing product complexity, decreasing component size, and using double sided boards have made rework more difficult and the economic reworking of PCBAs is one of the main problems facing PCB manufacturers. PCBA manufacturing has been relatively improved with fully automated, accurate