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Lead Free Rework
Successful rework and assembly methods have been developed
with lead-free solders for all types of components. During
the transition period to lead-free manufacturing rework practices
have to be developed that deal with the issues related to
handling, reworking, tracking and inspecting lead free PCB
assemblies.
more...
XRAY Inspection
XRAY imaging is a widely utilized analytical tool for the
SMT PCB manufacturing process. In PCB assembly area array
packages such as CGA, BGAs and CSPs with their concealed solder
joints, have become the main field of application for X-ray
inspection.
more...
IR Rework
Infrared rework systems offer several advantages to the rework
process. Due to the computer controlled heat and time sources
the profiles stored in the rework system are highly repeatable
and more precisely controlled compared to their hot air counterparts.
more...
Visual Inspection
A strong supplemental tool to XRAY, a boroscopic inspection
tool, allows hidden solder joint or joints that are in close
proximity to other nearby parts to be inspected and characterized.
BEST has the capability to inspect and troubleshoot process
defects through the use of this tool.
more...
Soldering Tip Videos
BEST IPC Master Instructors have put together hands-on demo
videos for common soldering practices.
more...
BGA Rework Process
The following describes the general BGA rework process covering
the development and criteria for establishing profiles for
BGA removal and replacement. X Ray Inspection Services >
USA
X Ray Inspection Services Suppliers - US (United States)Also
Known As: X Ray Inspection; Xray Inspection Services
We found 36 results
Page: 1 2 Go to page: of 2 Magnetic Inspection Laboratory,
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RNDT, Inc., Nadcap & ISO 17025 accredited NDT laboratory
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More detailsDocuments
@Willick Engineering Company Inc. Santa Fe Springs, CA, USA
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X-Tek Group, Inc. Tyngsboro, MA, USA
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Grid Simple item record
Please use this identifier to cite or link to this item: http://hdl.handle.net/10203/1607
Hit : 87 Download : 100 Metadata Downloads : or
Title Inspection of Ball Grid Array(BGA) Solder Joints using
X-ray Cross-sectional Images
Authors Roh, Y.J.; Ko, K.W.; Cho, H.S.; Kim, H.C.; Joo, H.N.;
Kim, S.K.
Keywords x-ray cross-sectional image; digital tomosynthesis;
solder joint inspection; BGA; neural network
Issue Date Sep-1999
Publisher International Society for Optical Engineering (SPIE)
Citation Intelligent Systems and Advanced Manufacturing,Boston,
USA, Vol. 3836, pp: 168-178
Abstract The ball grid array(BGA) chip is widely used in high
density printed circuit board(PCB). However, inspection of
defects in the solder joints is difficult by visual or a normal
x-ray imaging method, because unlike conventional packages
with guilwing type leads, solder joints of the BGA are located
underneath its own package and ball type leads. Therefore,
x-ray digital tomosynthesis(DT), which form a cross-sectional
image of 3-D objects, is needed to image and inspect the solder
joints of BGA. In this paper, we propose a series of algorithms
for inspecting the solder joints of BGA by using x-ray crosssectional
images that are acquired from the developed DT system. BGA
solder joints are examined to check the alignment between
the chip and pad on a PCB, bridge(electrically short), adequate
solder volume. The volnme of the solder joint is represented
by a gray level in the x-ray images : thus solderjoints can
be examined by use ofthe gray-level profiles of each joint.
To inspect and classify various defects, pattern classification
method using a learning vector quantization(LVQ) neural network
and a look up table(LUT) is proposed. The clusters into which
a gray-level profile is classified are generated by the learning
process ofthe network by using a number ofsampled gray-level
profiles. A series ofthese developed algorithms for inspecting
and classifying defects were tested on a number of BGA solder
joints. The experimental results show that the proposed method
yields satisfactory solutions for inspection based on x-ray
cross-sectional images.
Description Copyright 1999 Society of Photo-Optical Instrumentation
Engineers.
ISSN 0277-786X
URI http://hdl.handle.net/10203/1607
Appears in Collections ME-Conference Papers
Files in This Item:
File Description Size Format
123.pdf 906Kb Adobe PDF View/Open
Items in KOASAS are protected by copyright, with all rights
reserved, unless otherwise indicated.X-TEK GROUP X-RAY SYSTEM
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Exchange
X-ray systems for optimizing PCB inspection: x-ray systems
are not all equal, and their differences affect the type of
defects...
By:Lehmann, David K.
Publication: Circuits Assembly
Date: Friday, February 1 2002
Subject: Printed circuit boards (Inspection), Beverage processing
machinery, Quality control equipment (Usage), Electronics
industry (Inspection), Industrial x-ray equipment (Usage)
Product: Assembly & Inspection Equip, Industrial X-Ray
Equip, Beverage Quality Control Equipment, Printed Circuit
Boards
Location: United States
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En savoir plus sur CAT.INIST ?
? INIST Diffusion S.A.
Service Clients / Customer Service
2, all▽e du parc de Brabois
F-54514 Vandoeuvre Cedex France
T▽l : +33 (0) 3.83.50.46.64
Fax : +33 (0) 3.83.50.46.66
Courriel : infoclient@inist.fr
Titre du document / Document title
Inspection of ball grid array(BGA) solder joints using X-ray
cross-sectional images
Auteur(s) / Author(s)
ROH Y. J. (1) ; KO K. W. (1) ; CHO H. S. (1) ; KIM H. C. (2)
; JOO H. N. (2) ; KIM S. K. (2) ;
Affiliation(s) du ou des auteurs / Author(s) Affiliation(s)
(1) Dept. of Mechanical Eng., Korea Advanced Institute of
Science and Technology, COREE, REPUBLIQUE DE
(2) FA Research Institute Production Engineering Center, Samsung
Electroncs Co., LTD, COREE, REPUBLIQUE DE
R▽sum▽ / Abstract
The ball grid array(BGA) chip is widely used in high density
printed circuit board(PCB). However, inspection of defects
in the solder joints is difficult by visual or a normal x-ray
imaging method, because unlike conventional packages with
guilwing type leads, solder joints of the BGA are located
underneath its own package and ball type leads. Therefore,
x-ray digital tomosynthesis(DT), which form a cross-sectional
image of 3-D objects, is needed to image and inspect the solder
joints of BGA. In this paper, we propose a series of algorithms
for inspecting the solder joints of BGA by using x-ray cross-sectional
images that are acquired from the developed DT system. BGA
solder joints are examined to check the alignment between
the chip and pad on a PCB, bridge(electrically short), adequate
solder volume. The volume of the solder joint is represented
by a gray level in the x-ray images : thus solder joints can
be examined by use of the gray-level profiles of each joint.
To inspect and classify various defects, pattern classification
method using a learning vector quantization(LVQ) neural network
and a look up table(LUT) is proposed. The clusters into which
a gray-level profile is classified are generated by the learning
process of the network by using a number of sampled gray-level
profiles. A series of these developed algorithms for inspecting
and classifying defects were tested on a number of BGA solder
joints. The experimental results show that the proposed method
yields satisfactory solutions for inspection based on x-ray
cross-sectional images.
Revue / Journal Title
SPIE proceedings series
Source / Source
Congrès
Machine vision systems for inspection and metrology VIII :
( Boston MA, 21-22 September 1999 )
Machine vision systems for inspection and metrology. Conference
No8, Boston MA , ETATS-UNIS (21/09/1999)
1999, vol. 3836, pp. 168-178, [Note(s) : VII, 252 p., ] (18
ref.) ISBN 0-8194-3429-9 ; Illustration : Illustration ;
Langue / Language
Anglais
Editeur / Publisher
Society of Photo-Optical Instrumentation Engineers, Bellingham,
WA, INTERNATIONAL (1988) (Revue)
SPIE, Bellingham WA, ETATS-UNIS (1999) (Monographie)
Mots-cl▽s anglais / English Keywords
Inspection ; Solder ; Neural network ; X ray radiography ;
Digital system ; Binary image ; Three dimensional shape ;
Mots-cl▽s fran?ais / French Keywords
Inspection ; Produit apport brasage tendre ; R▽seau neuronal
; Radiographie RX ; Système num▽rique ; Image binaire ; Forme
tridimensionnelle ; Digital tomosynthesis ; Ball grid array
(BGA) ; Image RX transversalle ;
Mots-cl▽s espagnols / Spanish Keywords
Inspecci◣n ; Producto aportaci◣n soldadura blanda ; Red neuronal
; Radiografía RX ; Sistema num▽rico ; Imagen binaria ; Forma
tridimensional ;
Localisation / Location
INIST-CNRS, Cote INIST : 21760, 35400008009608.0180
Copyright 2007 INIST-CNRS. All rights reserved
Toute reproduction ou diffusion même partielle, par quelque
proc▽d▽ ou sur tout support que ce soit, ne pourra être faite
sans l'accord pr▽alable ▽crit de l'INIST-CNRS.
No part of these records may be reproduced of distributed,
in any form or by any means, without the prior written Home
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Contamination
Empty and Open
Improper Solder Paste Replacement
Joint Cracking
Ratcheting
Non-Contact
The VPI-Optical Inspection Systems are ideal for cost-effective,
high-quality BGA inspection and PCB inspection. EasyBraid
Co. Also offers BGA Software. Defects can be easily recognized
by any operator with basic soldering and rework experience,
even defects invisible with X-ray inspection.
View VPI Visual Inspection Technical Details
Download EasyBraid's Inspection Systems Catalog 492 kb pdf
Contact us to learn more
about BGA/PCB Inspection Inspection Systems
Learn more about Easy Braid’s solutions for your ball grid
array problem by contacting us. If you find a product or inspection
system that would work for you, request a sample or call for
more information.
Process Flow & Equipment Used for PCB Assembly Fabrication
- RoHS
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- - - - - - - - - - - - - - - - - - - - - - - - - - - - -
- - - - - - - -
Return 1 to Main
Material Receiving / Inspection / Management
Receiving tools & equipment
Receiving Department
Receives materials for fab.
Inspection tools & equipment
Inspection Group
Inspects materials per BOM. Reels arrangement & feeders
Kitting Group
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Material transfer processing
Distribution Group
Delivering kits to SMT group Material return processing
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Residue Material Handling
Return 2 to Main
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GC plus software tools
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Sends out Gerber files to ... Solder paste printer Dek 265
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research markets. Product line includes DC to DC converters,
photomultiplier power bases, high voltage supplies for mass
spectroscopy and analytical instrumentation, X-ray power sources
and high voltage digital meters.. (800)521-8382, Fax: (973)586-9771,
E-mail: Sales@ElectronTubes.com
FAXITRON X-RAY CORP. - Wheeling, IL - - Real-time Microfocus
X-Ray imaging systems designed for SMT assembly inspection,
semiconductors and PCBs. Our systems provide advantages of
real-time defect detection for electronics production, quality
control, research and development and failure analysis. (847)465-9729,
Fax: (847)465-9740, E-mail: Sales@Faxitron.com
FeinFocus USA, INC. - Stamford, CT - Install our FXS-160.40
system next to your production line for rapid random PCB sample
inspections. A modular system with x-, y-, and z-axes, with
tilt and rotate features using our signature state-of-the-art
X-ray tube. (203)969-2161, Fax: (203)969-2162, E-mail: Info@FeinFocus.com
MINI MICRO STENCIL, INC - San Marcos, CA - - Send your parts
to us and lower your cost of BGA production and rework and
for short run production verification. Hourly rates for X-Ray
services - Interpretation of failure returned in a detailed
diagnostic report. Over 20 year experience . (888)456-4823,
(760)591-3804, Fax: (760)591-0853, E-mail: Sales@MiniMicroStencil.com |