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Successful rework and assembly methods have been
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XRAY Inspection
XRAY imaging is a widely utilized analytical tool
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Visual Inspection
A strong supplemental tool to XRAY, a boroscopic
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BGA Rework Process
The following describes the general BGA rework
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replacement. X Ray Inspection Services > USA
X Ray Inspection Services Suppliers - US (United
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We found 36 results
Page: 1 2 Go to page: of 2 Magnetic Inspection
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More detailsDocuments
@Willick Engineering Company Inc. Santa Fe Springs,
CA, USA
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Operations Technology,Inc Blairstown, NJ, USA
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V.J. Technologies,Inc. Bohemia, NY, USA
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Willick Engineering Company, Inc. Santa Fe Springs,
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X-Tek Group, Inc. Tyngsboro, MA, USA
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TyRe x Group Austin, Texas, USA
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Computer Software, Computer Services, Computer
Network Services, Printed Circuit Consultancy
or Design or Production Services, Test and Measurement
Instrumentation, Asset Management, Ball Grid Simple
item record
Please use this identifier to cite or link to
this item: http://hdl.handle.net/10203/1607
Hit : 87 Download : 100 Metadata Downloads :
or
Title Inspection of Ball Grid Array(BGA) Solder
Joints using X-ray Cross-sectional Images
Authors Roh, Y.J.; Ko, K.W.; Cho, H.S.; Kim, H.C.;
Joo, H.N.; Kim, S.K.
Keywords x-ray cross-sectional image; digital
tomosynthesis; solder joint inspection; BGA; neural
network
Issue Date Sep-1999
Publisher International Society for Optical Engineering
(SPIE)
Citation Intelligent Systems and Advanced Manufacturing,Boston,
USA, Vol. 3836, pp: 168-178
Abstract The ball grid array(BGA) chip is widely
used in high density printed circuit board(PCB).
However, inspection of defects in the solder joints
is difficult by visual or a normal x-ray imaging
method, because unlike conventional packages with
guilwing type leads, solder joints of the BGA
are located underneath its own package and ball
type leads. Therefore, x-ray digital tomosynthesis(DT),
which form a cross-sectional image of 3-D objects,
is needed to image and inspect the solder joints
of BGA. In this paper, we propose a series of
algorithms for inspecting the solder joints of
BGA by using x-ray crosssectional images that
are acquired from the developed DT system. BGA
solder joints are examined to check the alignment
between the chip and pad on a PCB, bridge(electrically
short), adequate solder volume. The volnme of
the solder joint is represented by a gray level
in the x-ray images : thus solderjoints can be
examined by use ofthe gray-level profiles of each
joint. To inspect and classify various defects,
pattern classification method using a learning
vector quantization(LVQ) neural network and a
look up table(LUT) is proposed. The clusters into
which a gray-level profile is classified are generated
by the learning process ofthe network by using
a number ofsampled gray-level profiles. A series
ofthese developed algorithms for inspecting and
classifying defects were tested on a number of
BGA solder joints. The experimental results show
that the proposed method yields satisfactory solutions
for inspection based on x-ray cross-sectional
images.
Description Copyright 1999 Society of Photo-Optical
Instrumentation Engineers.
ISSN 0277-786X
URI http://hdl.handle.net/10203/1607
Appears in Collections ME-Conference Papers
Files in This Item:
File Description Size Format
123.pdf 906Kb Adobe PDF View/Open
Items in KOASAS are protected by copyright, with
all rights reserved, unless otherwise indicated.X-TEK
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Common Applications include: Medical devices,
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X-ray systems for optimizing PCB inspection: x-ray
systems are not all equal, and their differences
affect the type of defects...
By:Lehmann, David K.
Publication: Circuits Assembly
Date: Friday, February 1 2002
Subject: Printed circuit boards (Inspection),
Beverage processing machinery, Quality control
equipment (Usage), Electronics industry (Inspection),
Industrial x-ray equipment (Usage)
Product: Assembly & Inspection Equip, Industrial
X-Ray Equip, Beverage Quality Control Equipment,
Printed Circuit Boards
Location: United States
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En savoir plus sur CAT.INIST ?
? INIST Diffusion S.A.
Service Clients / Customer Service
2, all▽e du parc de Brabois
F-54514 Vandoeuvre Cedex France
T▽l : +33 (0) 3.83.50.46.64
Fax : +33 (0) 3.83.50.46.66
Courriel : infoclient@inist.fr
Titre du document / Document title
Inspection of ball grid array(BGA) solder joints
using X-ray cross-sectional images
Auteur(s) / Author(s)
ROH Y. J. (1) ; KO K. W. (1) ; CHO H. S. (1) ;
KIM H. C. (2) ; JOO H. N. (2) ; KIM S. K. (2)
;
Affiliation(s) du ou des auteurs / Author(s) Affiliation(s)
(1) Dept. of Mechanical Eng., Korea Advanced Institute
of Science and Technology, COREE, REPUBLIQUE DE
(2) FA Research Institute Production Engineering
Center, Samsung Electroncs Co., LTD, COREE, REPUBLIQUE
DE
R▽sum▽ / Abstract
The ball grid array(BGA) chip is widely used in
high density printed circuit board(PCB). However,
inspection of defects in the solder joints is
difficult by visual or a normal x-ray imaging
method, because unlike conventional packages with
guilwing type leads, solder joints of the BGA
are located underneath its own package and ball
type leads. Therefore, x-ray digital tomosynthesis(DT),
which form a cross-sectional image of 3-D objects,
is needed to image and inspect the solder joints
of BGA. In this paper, we propose a series of
algorithms for inspecting the solder joints of
BGA by using x-ray cross-sectional images that
are acquired from the developed DT system. BGA
solder joints are examined to check the alignment
between the chip and pad on a PCB, bridge(electrically
short), adequate solder volume. The volume of
the solder joint is represented by a gray level
in the x-ray images : thus solder joints can be
examined by use of the gray-level profiles of
each joint. To inspect and classify various defects,
pattern classification method using a learning
vector quantization(LVQ) neural network and a
look up table(LUT) is proposed. The clusters into
which a gray-level profile is classified are generated
by the learning process of the network by using
a number of sampled gray-level profiles. A series
of these developed algorithms for inspecting and
classifying defects were tested on a number of
BGA solder joints. The experimental results show
that the proposed method yields satisfactory solutions
for inspection based on x-ray cross-sectional
images.
Revue / Journal Title
SPIE proceedings series
Source / Source
Congrès
Machine vision systems for inspection and metrology
VIII : ( Boston MA, 21-22 September 1999 )
Machine vision systems for inspection and metrology.
Conference No8, Boston MA , ETATS-UNIS (21/09/1999)
1999, vol. 3836, pp. 168-178, [Note(s) : VII,
252 p., ] (18 ref.) ISBN 0-8194-3429-9 ; Illustration
: Illustration ;
Langue / Language
Anglais
Editeur / Publisher
Society of Photo-Optical Instrumentation Engineers,
Bellingham, WA, INTERNATIONAL (1988) (Revue)
SPIE, Bellingham WA, ETATS-UNIS (1999) (Monographie)
Mots-cl▽s anglais / English Keywords
Inspection ; Solder ; Neural network ; X ray radiography
; Digital system ; Binary image ; Three dimensional
shape ;
Mots-cl▽s fran?ais / French Keywords
Inspection ; Produit apport brasage tendre ; R▽seau
neuronal ; Radiographie RX ; Système num▽rique
; Image binaire ; Forme tridimensionnelle ; Digital
tomosynthesis ; Ball grid array (BGA) ; Image
RX transversalle ;
Mots-cl▽s espagnols / Spanish Keywords
Inspecci◣n ; Producto aportaci◣n soldadura blanda
; Red neuronal ; Radiografía RX ; Sistema num▽rico
; Imagen binaria ; Forma tridimensional ;
Localisation / Location
INIST-CNRS, Cote INIST : 21760, 35400008009608.0180
Copyright 2007 INIST-CNRS. All rights reserved
Toute reproduction ou diffusion même partielle,
par quelque proc▽d▽ ou sur tout support que ce
soit, ne pourra être faite sans l'accord pr▽alable
▽crit de l'INIST-CNRS.
No part of these records may be reproduced of
distributed, in any form or by any means, without
the prior written Home About Us Material Safety
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Contamination
Empty and Open
Improper Solder Paste Replacement
Joint Cracking
Ratcheting
Non-Contact
The VPI-Optical Inspection Systems are ideal
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View VPI Visual Inspection Technical Details
Download EasyBraid's Inspection Systems Catalog
492 kb pdf
Contact us to learn more
about BGA/PCB Inspection Inspection Systems
Learn more about Easy Braid’s solutions for your
ball grid array problem by contacting us. If you
find a product or inspection system that would
work for you, request a sample or call for more
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Process Flow & Equipment Used for PCB Assembly
Fabrication - RoHS
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Return 1 to Main
Material Receiving / Inspection / Management
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Inspects materials per BOM. Reels arrangement
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Delivering kits to SMT group Material return processing
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Fax: (408)980-0524, E-mail: Info@Axic.com
CSA /AGILENT - CUSTOMER SERVICE ASSOCIATES -
Lenexa, KS - - Sales & support for HP/Agilent
products that test and inspect throughout the
electronics manufacturing process, from AOI solder
and paste placement inspection to 3D X-ray and
In-circuit Inspection and Functional Test. ICT
(3070), AXI (5DX), AOI (SJ-50 & SP-50) and
MTIS (ART, AQT, CAMCAD) solutions in partnership
with Agilent Direct Sales. (888)745-5286, (913)322-0872,
Fax: (973)322-0873, E-mail: Sales@CSA1.net TDE
membership candidate 8/18/05
ELECTRON TUBES, INC. - Rockaway, NJ - - Manufacturers
and distributors of high voltage power supplies
to the OEM and research markets. Product line
includes DC to DC converters, photomultiplier
power bases, high voltage supplies for mass spectroscopy
and analytical instrumentation, X-ray power sources
and high voltage digital meters.. (800)521-8382,
Fax: (973)586-9771, E-mail: Sales@ElectronTubes.com
FAXITRON X-RAY CORP. - Wheeling, IL - - Real-time
Microfocus X-Ray imaging systems designed for
SMT assembly inspection, semiconductors and PCBs.
Our systems provide advantages of real-time defect
detection for electronics production, quality
control, research and development and failure
analysis. (847)465-9729, Fax: (847)465-9740, E-mail:
Sales@Faxitron.com
FeinFocus USA, INC. - Stamford, CT - Install
our FXS-160.40 system next to your production
line for rapid random PCB sample inspections.
A modular system with x-, y-, and z-axes, with
tilt and rotate features using our signature state-of-the-art
X-ray tube. (203)969-2161, Fax: (203)969-2162,
E-mail: Info@FeinFocus.com
MINI MICRO STENCIL, INC - San Marcos, CA - -
Send your parts to us and lower your cost of BGA
production and rework and for short run production
verification. Hourly rates for X-Ray services
- Interpretation of failure returned in a detailed
diagnostic report. Over 20 year experience . (888)456-4823,
(760)591-3804, Fax: (760)591-0853, E-mail: Sales@MiniMicroStencil.com